Please click on the green button to complete the questionnaire
SoftIE is an EU-funded project working towards a common industry standard for e-textile connectivity. The project aim is to map the needs of commercial e-textile products and to develop the soft and flexible conductive and insulating materials, and adhesives, that will allow attachment of interchangeable bonding layers facilitating interconnection to integrated circuitry and mounting of external connectors on a broad range of textiles and e-textile substrates. Focus on sustainability and future requirements means that interconnects, encapsulation materials and adhesives will be designed to be removed for repair/replacement and re-use at the end of product life. That’s why we are interested in hearing about the connectivity solutions and fabrics used in current products, but also about any challenges currently faced and what future needs might look like.
We record the company name only in case we have subsequent questions, and we treat all data from this meeting confidentially. We are the only people who will have access to your responses. Nothing attributable to your company will be published, only anonymised, collated findings from across all interviews.
Estimated time: 20 – 30 minutes